TSP Global has abilities to make best modules using all kind of engineering power such as understanding
DRAMs, component test know-hows, and technical support including full level of failure analysis. Those
engineering powers make possible to satisfy any kinds of customer requirements, both of technical and
financial point of view.
We guarantee products’ characteristics and reliability through our component tests, module tests and system tests.
We also improve our products’ quality for ceaseless developments of new algorithm.
We will assure to provide better products through better test scenarios.
1. Component Test
2. Module Test
3. System Level Test
Mass Production Test
1. AC/DC Test
2. Function Test
3. Cell & Core Hot / Cold Test
4. High Frequency Hot / Cold Test
5. Over Clocking
TSP Global has all kinds of facilities to make and guarantee quality of various types of modules.
Facilities are includes ATE(Automatic Test Equipment) and automatic handlers for component test, module PCB
design ability, SMT(Surface Mount Technology), system boards for SLT(System Level Test), and packing machines.
Effects of Heat-Sink
TSP Global also making various types of module with Heat-Sink and LED lighting. The purpose of Heat-Sink is
lowering module temperature and specially effective at OC(Over Clocking) modules operating at upper
3000Mbps. The experiment results show more than 15’C down after Heat-Sink installation.