History

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MEMORY PRODUCTS SPECIALIST
TSP  GLOBAL
Company
History

History

History

 2018

‘18. 09 : 32GB/16GB RDIMM Supermicro Qualification

‘18. 08 : 10 Patents are Registered & 6 Patents on Progress
‘18. 04 : Start DDR4 RDIMM Business
‘18. 02 : Establish SSP(Surface Solution Provider)  

 

 2017

‘17. 07 : Start eMMC/UFS(NAND) & LPDDR4 Production

‘17. 05 : Launch TSP Global own Memory Brand Business
‘17. 02 : 4 Patents are Registered & 6 Patents on Progress
‘17. 02 : Start eMCP business 

 

 2016

‘16. 11 : eMMC Sample Distribution
’16. 09 : Setup Chip Detaching Line
‘16. 08 : 3 Patents are Registered & 3 Patents on Progress
‘16. 07 : OC Module Mass production for PNY
‘16. 04 : Launch Flash Business
‘16. 01 : Established  R&D Center 
‘16. 01 : Certificate  ISO 9001 : 2015   

 

 2015

‘15. 12 : Korea Industrial Technology Association Membership
‘15. 10 : DDR4 RDIMM sample Manufacture 
‘15. 06 : Setup New Manufacturing Factory Dongtan  

 

 2014

‘14. 12 : Bonded factory installation and operation
‘14. 07 : Start Module business with Essencore
‘14. 06 : Gaming High Speed Module development
‘14. 05 : Setup Manufacuring Factory Yangji
‘14. 04 : DDR3 RDIMM Qualification from CAVIUM
‘14. 02 : Certified Venture Company     

 

 2013

‘13. 05 : Established  


Postcode 18487
67, Dongtansandan 10-gil, Dongtan-myeon, Hwaseong-si, Gyeonggi-do, Korea
TEL :   +82-31-8015-5253  FAX: +82 31-8015-5254 E-Mail : ccjoo@tspglobal.co.kr